Production Process for LCD Module

- Mar 17, 2020-

SMT

 

Surface mount technology

 

That is, surface mounting technology, which is a more traditional mounting method. Its advantages are high reliability, but its disadvantages are large size and high cost, which limits the miniaturization of LCM.

 

COB

 

Chip On Board

 

That is, the chip is bonded on the PCB.

 

The production of chips is reducing the output of QFP (a type of SMT) package. Therefore, the traditional SMT method will be gradually replaced in future products.

 

TAB

 

Tape Aotomated Bonding

 

Anisotropic conductive adhesive connection. Encapsulation is TCP (Tape Carrier

 

Package IC) is fixed on the LCD and PCB with anisotropic conductive adhesive. This installation method can reduce the weight, volume, convenient installation and better reliability of the LCM!

 

COG

Chip On Glass

 

The chip is directly bonded to the glass. This installation method can greatly reduce the size of the entire LCD module, and is easy to mass-produce. It is suitable for LCDs for consumer electronics, such as mobile phones, PDAs and other portable electronic products. This installation method, driven by IC manufacturers, will be the main connection method between IC and LCD in the future.

 

COF

Chip On Film

 

The chip is mounted directly on the flexible PCB. This connection method has a high degree of integration, and peripheral components can be mounted on the flexible PCB together with the IC. This is an emerging technology that has entered the trial production stage.